Company Filing History:
Years Active: 2025
Title: Takako Tanigawa: Innovator in Temporary Bonding Technologies
Introduction
Takako Tanigawa is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of temporary bonding technologies, particularly in the manufacturing of electronic devices. With a total of 2 patents to her name, her work is recognized for its innovative approaches and practical applications.
Latest Patents
Tanigawa's latest patents focus on compositions for temporary bonding. The first patent describes a composition that includes a (meth)acrylate with specific characteristics, such as a monofunctional (meth)acrylate with a side chain of an alkyl group containing 18 or more carbon atoms. This composition is designed for temporary bonding applications and includes a polyisobutene homopolymer and a photo radical polymerization initiator. The second patent also pertains to an adhesive for temporary bonding, which incorporates similar components, ensuring effective performance in electronic device manufacturing.
Career Highlights
Throughout her career, Takako Tanigawa has been associated with Denka Company Limited, where she has played a crucial role in developing innovative bonding solutions. Her expertise in the field has led to advancements that enhance the efficiency and reliability of electronic devices.
Collaborations
Tanigawa has collaborated with notable colleagues, including Tometomo Uchida and Takashi Domoto. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Takako Tanigawa's contributions to temporary bonding technologies highlight her innovative spirit and dedication to advancing the field. Her patents reflect a commitment to improving manufacturing processes in the electronics industry.