Denka Company Limited

Takako Tanigawa

Takashi Domoto

Tometomo Uchida

Jun Watanabe

Jun Yoshida

Toru Arai

Yoshitsugu Goto

Kenji Nomura

Megumi Sudo

A composition for temporary bonding, includes: (A) a (meth)acrylate having the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose side chain is an alkyl group having 18 or more carbon atoms and homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer and/or a polyisobutene copolymer; and (C) a photo radical polymerization initiator.

Composition

A composition for temporary bonding, including the following (A) to (C). An adhesive for temporary bonding for manufacturing an electronic device, including the composition for temporary bonding. (A) A (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer; and (C) a photo radical polymerization initiator.

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Tokyo, Japan

Takako Tanigawa