Kanagawa, Japan

Takahisa Doba

This inventor holds 2 USPTO granted patents. Top assignee: Henkel Corporation. Active years: 2006-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahisa Doba. Retrieved from https://idiyas.com/inventor/takahisa-doba

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2006-2011

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2 patents (USPTO):Explore Patents

Title: The Innovations of Takahisa Doba

Introduction

Takahisa Doba is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of thermosetting resin compositions, particularly in applications related to semiconductor devices. With a total of two patents to his name, Doba's work is recognized for its innovative approach to enhancing the functionality of electronic components.

Latest Patents

Doba's latest patents include a reworkable thermosetting resin composition. This invention is particularly useful for mounting semiconductor devices onto circuit boards, such as Chip Scale Packages (CSPs), Ball Grid Arrays (BGAs), and Land Grid Arrays (LGAs). The compositions developed by Doba are designed to be reworkable under appropriate conditions, providing flexibility in the manufacturing process. Another significant patent is for reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent. Similar to his previous invention, this composition is also aimed at enhancing the mounting of semiconductor chips on carrier substrates.

Career Highlights

Takahisa Doba is currently employed at Henkel Corporation, where he continues to innovate in the field of materials science. His work has been instrumental in advancing the technology used in electronic manufacturing, particularly in improving the reliability and efficiency of semiconductor devices.

Collaborations

Doba has collaborated with several professionals in his field, including Andrew D Messana and Afranio Torres-Filho. These collaborations have contributed to the development of his innovative patents and have fostered a productive environment for research and development.

Conclusion

Takahisa Doba's contributions to the field of thermosetting resin compositions have made a significant impact on the semiconductor industry. His innovative patents reflect a commitment to enhancing electronic manufacturing processes. Doba's work continues to influence the development of reliable and efficient semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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