Takahiro Yoshida

Title: Takahiro Yoshida: Innovator in Copper Clad Laminate Technology

Introduction

Takahiro Yoshida is a notable inventor based in Yamaguchi, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper clad laminates. His innovative work focuses on enhancing the performance and reliability of flexible circuit boards.

Latest Patents

Takahiro Yoshida holds a patent for a copper clad laminate and the method for producing the same. The patent addresses the need for high adhesion between a low dielectric resin film and a copper plating layer. It also aims to achieve good volume resistivity while minimizing transmission loss when applied to flexible circuit boards. The copper clad laminate features a low dielectric resin film with a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz. Additionally, the electroless copper plating layer has a weighted average size of crystallites ranging from 25 to 300 nm, with an adhesion strength of 4.2 N/cm or more between the resin film and the copper plating layer.

Career Highlights

Takahiro Yoshida is associated with Toyo Kohan, Ltd., where he has been instrumental in advancing the company's research and development efforts. His work has led to significant improvements in the performance of electronic materials, particularly in the realm of flexible electronics.

Collaborations

Takahiro has collaborated with notable colleagues such as Nobuaki Mukai and Youhei Yoshimatsu. Their combined expertise has contributed to the successful development of innovative materials and technologies.

Conclusion

Takahiro Yoshida's contributions to the field of copper clad laminates exemplify his commitment to innovation and excellence in materials science. His patent reflects a significant advancement in the technology used for flexible circuit boards, showcasing his role as a leading inventor in this domain.