Company Filing History:
Years Active: 2018
Title: Takahiro Setaka: Innovator in Bonding Technology
Introduction
Takahiro Setaka is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of bonding technology, particularly through his innovative methods and apparatus.
Latest Patents
One of his key patents is a bonding method and bonding apparatus. This invention includes an adhesive layer forming process where a thermoplastic adhesive is applied to a substrate or a support plate, followed by a heating process that heats the adhesive layer. Finally, a bonding process is executed where the substrate and the support plate are pressed against each other via the heated adhesive layer, effectively bonding them together. This patent showcases his expertise in creating efficient bonding solutions.
Career Highlights
Takahiro Setaka is associated with Tokyo Ohka Kogyo Co., Ltd., a company known for its advancements in chemical products and materials. His work there has allowed him to focus on developing innovative bonding techniques that enhance product performance.
Collaborations
He has collaborated with notable coworkers such as Atsushi Miyanari and Yoshihiro Inao, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Takahiro Setaka's contributions to bonding technology through his patent and work at Tokyo Ohka Kogyo Co., Ltd. highlight his role as a significant inventor in the field. His innovative methods continue to influence advancements in bonding applications.