Yokkaichi, Japan

Takahiro Ozu


Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 32(Granted Patents)


Location History:

  • Mie, JP (1986 - 1993)
  • Yokkaichi, JP (1988 - 1994)

Company Filing History:


Years Active: 1986-1994

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5 patents (USPTO):Explore Patents

Title: Takahiro Ozu: Innovator in Adhesive Resin Technology

Introduction

Takahiro Ozu is a prominent inventor based in Yokkaichi, Japan. He has made significant contributions to the field of adhesive resin technology, holding a total of 5 patents. His work focuses on developing innovative materials that enhance adhesion properties, particularly between fluorine-containing resins and metal substrates.

Latest Patents

Ozu's latest patents include an adhesive resin composition that comprises a polymer of a radically polymerizable epoxy resin and a monomer. This composition is designed to provide excellent adhesion between fluorine-contained resins and metal substrates. Another notable patent is a process for preparing a laminate, which involves adhering a layer of an olefin polymer to a layer of a fluororesin using an adhesive polymer. This process utilizes a polymerization product that includes essential components such as alkyl acrylate and fluorine-containing unsaturated monomers.

Career Highlights

Takahiro Ozu has built a successful career at Mitsubishi Petrochemical Company Limited. His innovative approaches to adhesive technology have positioned him as a key figure in the industry. Ozu's patents reflect his commitment to advancing material science and improving product performance.

Collaborations

Throughout his career, Ozu has collaborated with notable coworkers, including Keizo Abe and Kazuhide Hayama. These partnerships have contributed to the development of cutting-edge technologies in adhesive materials.

Conclusion

Takahiro Ozu's contributions to adhesive resin technology demonstrate his expertise and innovative spirit. His patents not only enhance product performance but also pave the way for future advancements in the field.

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