This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Rengo Co., Ltd.. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: **Takahiro Okuda: Innovator in Locking Structures**
Introduction
Takahiro Okuda, based in Matsudo, Japan, is an inventor recognized for his innovative contributions in the field of container design and assembly. His unique approach has led to the development of a specialized locking structure that enhances the functionality and usability of containers.
Latest Patents
Okuda holds a patent for a "Locking structure, container utilizing locking structure, and container assembling apparatus." This patent details a locking receiving portion defined by first and second inclined lines extending from a branching point on the fold line between two panels. The design includes a cut portion that facilitates a stable assembly when the container is put together. The locking portion is integrated into the third panel, allowing it to be securely locked in an assembled state, showcasing Okuda's innovative thinking in structural design.
Career Highlights
Takahiro Okuda has garnered significant expertise through his career at Rengo Co., Ltd., a company known for its focus on packaging solutions. His work has not only added value to the company but has also contributed to advancements in material science and product design.
Collaborations
Throughout his career, Okuda has collaborated with esteemed colleagues such as Takafumi Makiuchi and Noriyoshi Azuma. These collaborations have fostered a creative environment, enabling the development of new ideas and solutions in packaging technology.
Conclusion
Takahiro Okuda exemplifies the spirit of innovation through his patent and contributions to Rengo Co., Ltd. His work in container locking structures highlights his commitment to enhancing product safety and functionality, paving the way for future advancements in packaging design.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile