Iga, Japan

Takahiro Nishiki

This inventor holds 1 USPTO granted patent. Top assignee: Dmg Mori Seiki Co., Ltd.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahiro Nishiki. Retrieved from https://idiyas.com/inventor/takahiro-nishiki-jbcic4ae

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Takahiro Nishiki and His Machine-Tool Bearing Innovation.

Introduction

Takahiro Nishiki is an inventor associated with Iga, Japan, and DMG MORI SEIKI Co., Ltd. His patent work addresses bearing preload in machine-tool spindles, a component area important to spindle assembly and operation.

Latest Patents

Nishiki is associated with 1 patent, titled “Bearing Preload Structure of Machine Tool.” The invention describes a spindle arrangement with two ball bearings and a collar positioned between a flange and the inner ring of the second bearing. The collar’s axial dimension is slightly longer than a specified distance between the bearing-related surfaces. This configuration establishes the described preload structure while allowing the flange to be attached to or removed from the spindle.

Career Highlights

Nishiki’s listed patent reflects work on mechanical design for machine tools, particularly the relationship between spindle surfaces, bearing inner rings, and a collar. The available information identifies DMG MORI SEIKI Co., Ltd. as his company.

Collaborations

Kazutoyo Moriguchi is identified as Nishiki’s coworker. The available details do not specify their particular collaboration on the patent.

Conclusion

Takahiro Nishiki’s patent focuses on a bearing preload structure for machine tools, illustrating his contribution to spindle and bearing design at DMG MORI SEIKI Co., Ltd.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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