Kyoto, Japan

Takahiro Kimura

USPTO Granted Patents = 2 

Average Co-Inventor Count = 6.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023-2024

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2 patents (USPTO):Explore Patents

Title: Takahiro Kimura: Innovator in Substrate Processing Technologies

Introduction

Takahiro Kimura is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of substrate processing, particularly through his innovative methods and apparatuses. With a total of 2 patents, Kimura's work has advanced the efficiency of substrate processing techniques.

Latest Patents

Kimura's latest patents include a substrate processing method and a substrate processing apparatus. The first patent describes a method where a liquid film of a processing liquid, containing components such as sulfuric acid and hydrogen peroxide, is formed on a substrate. A plasma is then radiated to this liquid film, allowing for efficient substrate processing using the oxidizing power of the processing liquid. The second patent outlines a substrate processing method that involves supplying a processing solution onto the substrate's upper surface. This method executes plasma processing under atmospheric pressure on a liquid film of varying thicknesses, enabling the efficient removal of resists from the substrate.

Career Highlights

Takahiro Kimura is associated with Screen Holdings Co., Ltd., where he continues to develop innovative solutions in substrate processing. His work has been instrumental in enhancing the capabilities of processing technologies used in various applications.

Collaborations

Kimura has collaborated with notable colleagues, including Akira Horikoshi and Shigeru Takatsuji. These collaborations have further enriched his research and development efforts in the field.

Conclusion

Takahiro Kimura's contributions to substrate processing technologies exemplify his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving efficiency and effectiveness in substrate processing methods.

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