The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Aug. 11, 2021
Screen Holdings Co., Ltd., Kyoto, JP;
Akira Horikoshi, Kyoto, JP;
Miyoshi Ueno, Kyoto, JP;
Yayoi Takeichi, Kyoto, JP;
Takaaki Yanagida, Kyoto, JP;
Kenji Nakanishi, Kyoto, JP;
Shigeru Takatsuji, Kyoto, JP;
Takahiro Kimura, Kyoto, JP;
SCREEN HOLDINGS CO., LTD., Kyoto, JP;
Abstract
A substrate processing method includes: supplying a processing solution onto the upper surface of the substrate; executing, under atmospheric pressure, plasma processing on a liquid film of the processing solution that is formed at least in part of the upper surface of the substrate, with a thickness of the liquid film being a first thickness; and executing, under atmospheric pressure, plasma processing on the liquid film of the processing solution that is formed at least in part of the upper surface of the substrate, with the thickness of the liquid film being a second thickness, in which the first thickness is smaller than the second thickness. Thus, resists on the upper surface of the substrate can be efficiently removed.