Owariasahi, Japan

Takahiro Hara

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahiro Hara. Retrieved from https://idiyas.com/inventor/takahiro-hara-346ydazh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:

goldMedal1 out of 834,659 
Other
 patents

Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Takahiro Hara: Innovator in Filling Technology

Introduction

Takahiro Hara is a notable inventor based in Owariasahi, Japan. He has made significant contributions to the field of filling technology, particularly with his innovative approach to packing systems.

Latest Patents

Hara holds a patent for a "Filling device and filling method." This invention involves a filler material packing system designed for packing granular or fragmental filler materials into bag-shaped hollow surface materials. The system includes a suction pump, a suction-type packing container, and a feeder for delivering the filler material. The design allows for efficient packing through a well-structured delivery mechanism.

Career Highlights

Throughout his career, Takahiro Hara has focused on enhancing the efficiency and effectiveness of packing systems. His work has led to advancements in how materials are handled and packed, showcasing his commitment to innovation in this area.

Collaborations

Hara has collaborated with notable colleagues, including Taro Ogawa and Yasumasa Senoo. These partnerships have contributed to the development and refinement of his inventions.

Conclusion

Takahiro Hara's contributions to filling technology exemplify the impact of innovative thinking in practical applications. His patent reflects a significant advancement in packing systems, demonstrating his role as a key inventor in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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