Beppu, Japan

Takahiko Kudoh

This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2011-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahiko Kudoh. Retrieved from https://idiyas.com/inventor/takahiko-kudoh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2011-2022

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4 patents (USPTO):Explore Patents

Title: Takahiko Kudoh: Innovating in Multi-Chip Module Technology

Introduction

Takahiko Kudoh is a prominent inventor based in Beppu, Japan, renowned for his contributions to innovations in electronics. With an impressive portfolio of four patents, he has made significant strides in the field of multi-chip module technology, showcasing his creativity and technical prowess.

Latest Patents

Kudoh's latest patent focuses on a Multi-Chip Module (MCM) that includes stacked power devices utilizing a unique metal clip design. This innovative package features a substrate with multiple metal terminals and at least one die attach area, which is encapsulated around the substrate. The design allows for a first device, equipped with two device terminals, to be attached face up, while a second device is flip-chip attached and stacked on the first. Notably, at least one of these devices incorporates a transistor, enhancing the module's functionality. The ingenuity of this MCM lies in its use of a metal clip situated between the two devices, comprised of multiple isolated clip portions. These portions effectively connect device terminals to respective metal terminals, facilitating improved electrical performance.

Career Highlights

Takahiko Kudoh has made his mark at Texas Instruments Corporation, where he continues to drive advancements in semiconductor technology. His record of patenting innovations reflects his dedication to enhancing electronic systems and powering the future of technology.

Collaborations

Throughout his career, Kudoh has worked alongside talented colleagues, including Marie Denison and Richard J Saye. Their collaborative efforts have fostered an environment of innovation and creativity, leading to groundbreaking advancements in multi-chip technologies.

Conclusion

Takahiko Kudoh exemplifies the spirit of innovation within the electronics industry. With his noteworthy inventions and effective collaborations at Texas Instruments Corporation, he continues to pave the way for future developments in multi-chip module technology. His contributions will undoubtedly leave a lasting impact on the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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