Kiryu, Japan

Takahiko Kawai

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Honda Motor Co., Ltd.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahiko Kawai. Retrieved from https://idiyas.com/inventor/takahiko-kawai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Takahiko Kawai: Innovator in Material Bonding Technology

Introduction

Takahiko Kawai is a notable inventor based in Kiryu, Japan. He has made significant contributions to the field of material bonding technology, particularly through his innovative patent. His work has implications for various industries, including automotive and electronics.

Latest Patents

Takahiko Kawai holds a patent for a "Bonded body made from different materials and method for producing the same." This invention involves the formation of a water-repellent film on a first joint surface of a first member made from macromolecular, metallic, or inorganic materials. The film undergoes an activation treatment, transforming it into a highly hydrophilic film with a nylon 6 contact angle of less than 25°. A second joint surface, made from a thermoplastic resin, is then placed on the first joint surface, heated, melted, and subsequently cooled to bond the two surfaces together.

Career Highlights

Throughout his career, Takahiko Kawai has worked with prominent companies such as Honda Motor Co., Ltd. and Mitsubishi Electric Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in material technology.

Collaborations

Takahiko Kawai has collaborated with notable individuals in his field, including Hiroshi Akita and Shinichi Kuroda. These partnerships have fostered innovation and have been instrumental in the development of his patented technology.

Conclusion

Takahiko Kawai's contributions to material bonding technology exemplify the impact of innovative thinking in engineering. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving material applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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