This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 1981.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1981
Title: Takahiko Ichimura: Semiconductor Wafer Processing Inventor.
Introduction
Takahiko Ichimura is an inventor associated with Itami, Japan, and Mitsubishi Denki Kabushiki Kaisha, known internationally as Mitsubishi Electric. His recorded patent concerns a process for preparing semiconductor pellets from a wafer.
Latest Patents
Ichimura’s listed patent, “Process for Preparing Semiconductor Device by Forming Reinforcing Regions,” describes dividing a semiconductor wafer into pellet-forming regions and creating reinforcing regions between them and around the wafer’s perimeter. These regions help prevent wafer breakage without increasing pellet thickness, enabling more pellets with suitable characteristics to be obtained from a large-diameter wafer with minimal material loss. His recorded portfolio includes 1 patent.
Career Highlights
The available information connects Ichimura’s invention to semiconductor manufacturing at Mitsubishi Electric. The process addresses wafer strength and material efficiency during pellet preparation.
Collaborations
Ichimura’s listed coworkers include Shigeru Hokuyo and Takeshi Yamamoto.
Conclusion
Takahiko Ichimura’s recorded patent focuses on reinforcing semiconductor wafers during pellet preparation to reduce breakage and improve material yield.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile