This inventor holds 1 USPTO granted patent. Top assignees: Ngk Insulators, Inc., Nippondenso Co., Ltd.. Active years: 1992.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 5,088 
1 out of 3,252 Years Active: 1992
Title: Takahashi Nagasaka: Inventor of a Ceramic Multilayer Wiring Substrate
Introduction
Takahashi Nagasaka is an inventor associated with Anjo, Japan. His work includes a patent for a ceramic multilayer wiring substrate, developed to help protect internal conductors from oxidation in high-temperature environments. His recorded patent portfolio includes 1 patent.
Latest Patents
Nagasaka’s patent, “Ceramic Multi-Layer Wiring Substrate and Process for Preparation Thereof,” describes a multilayer wiring board made from alternating insulating and refractory metal layers. The outermost refractory metal layer covers the edge of the outermost insulating layer, while an oxidation-resistant barrier is formed over the metal layer. A thick-film conductor is then formed on the outermost insulating layer and barrier.
This arrangement helps prevent defects at the insulating layer’s edge and protects inner conductor layers from oxidation, including in high-temperature oxidizing atmospheres.
Career Highlights
Nagasaka’s listed company affiliations include Nippondenso Co., Ltd. and NGK Insulators, Inc. His patent reflects work on ceramic substrates and multilayer wiring structures.
Collaborations
Tadahiko Morimoto and Michio Asai are identified as Nagasaka’s coworkers.
Conclusion
Takahashi Nagasaka’s patent addresses the durability of ceramic multilayer wiring boards by combining layered conductors with an oxidation-resistant barrier.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile