Yamanashi, Japan

Taisuke Mori

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2018-2020

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Taisuke Mori: Innovator in Electronic Component Mounting Technology

Introduction

Taisuke Mori is a prominent inventor based in Yamanashi, Japan. He has made significant contributions to the field of electronic component mounting, holding a total of 2 patents. His innovative approaches have enhanced the efficiency and effectiveness of component mounting systems.

Latest Patents

Mori's latest patents include an electronic component mounting method and a component mounting apparatus. The electronic component mounting method involves a system that utilizes a component mounting line formed by interconnecting units that perform component mounting work on two types of boards with different workloads. This method includes mechanisms for board conveyance and a distribution control unit that manages the flow of boards based on demand signals.

The component mounting apparatus features a component supply device that feeds a carrier tape containing components stored in pockets. This device is designed to adjust the feed pitch based on the measured formation pitch of the pockets, ensuring precise component placement on the boards.

Career Highlights

Mori is currently employed at Panasonic Intellectual Property Management Co., Ltd., where he continues to develop innovative solutions in electronic component technology. His work has been instrumental in advancing the capabilities of component mounting systems.

Collaborations

Mori collaborates with notable colleagues, including Kenji Kamakura and Hideaki Kato, who contribute to the innovative environment at Panasonic.

Conclusion

Taisuke Mori's contributions to electronic component mounting technology exemplify the spirit of innovation. His patents reflect a commitment to improving manufacturing processes and enhancing the efficiency of electronic assembly.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…