The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Feb. 20, 2014
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Masayuki Higashi, Yamanashi, JP;
Taisuke Mori, Yamanashi, JP;
Ryouji Kouchi, Kanagawa, JP;
Takuya Yamazaki, Yamanashi, JP;
Hisashi Maezono, Yamanashi, JP;
Hiroshi Ando, Yamanashi, JP;
Abstract
An electronic component mounting method is performed by an electronic component mounting system including a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit. The electronic component mounting method comprises mixedly distributing the two kinds of the boards to each of the first and second board conveyance mechanisms based on a board request signal issued from a most-upstream component mounting unit in the component mounting line.