Tokyo, Japan

Taiki Sakamoto

This inventor holds 1 USPTO granted patent. Top assignee: Toyo Ink Sc Holdings Co., Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Taiki Sakamoto. Retrieved from https://idiyas.com/inventor/taiki-sakamoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: The Innovations of Taiki Sakamoto

Introduction

Taiki Sakamoto is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of thermal conductivity materials. His work focuses on developing innovative solutions that enhance the performance of thermal conductive materials.

Latest Patents

Sakamoto holds a patent for an easily deformable aggregate and methods for manufacturing thermally conductive resin compositions, members, and adhesive sheets. The objective of his invention is to provide a thermal conductivity-giving material that can achieve comparable or superior thermal conductivity levels using less material than conventional options. This is accomplished through the use of thermally conductive particles and an organic binding agent, resulting in a product that is both effective and efficient.

Career Highlights

Sakamoto is associated with Toyo Ink SC Holdings Co., Ltd., where he continues to innovate in the field of thermal materials. His work has garnered attention for its practical applications in various industries, particularly in electronics and manufacturing.

Collaborations

Sakamoto collaborates with talented colleagues, including Kaori Sakaguchi and Atsushi Nakazato. Their combined expertise contributes to the advancement of their projects and the development of new technologies.

Conclusion

Taiki Sakamoto's contributions to thermal conductivity materials exemplify the spirit of innovation in modern engineering. His work not only addresses current challenges but also paves the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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