Ibaraki, Japan

Taiki Kitagawa

This inventor holds 2 USPTO granted patents and 5 published patent applications. Top assignee: Nitto-Denko Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Taiki Kitagawa. Retrieved from https://idiyas.com/inventor/taiki-kitagawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Taiki Kitagawa: Inventor of a Re-Peelable Adhesive Technology.

Introduction

Taiki Kitagawa is an inventor based in Ibaraki, Japan. His work includes a patent for a water-dispersed pressure-sensitive adhesive composition and a pressure-sensitive adhesive sheet designed for re-peeling.

Latest Patents

Kitagawa is associated with 1 patent: “Water-dispersed pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet for re-peeling.” The invention combines a water-dispersed acrylic polymer, an active energy ray-curable resin, and a photopolymerization initiator. The acrylic polymer has two or more glass transition temperatures. The composition is designed to provide strong adhesion while also allowing the sheet to be peeled from an adherend.

Career Highlights

Kitagawa is associated with Nitto-Denko Corporation. His patented work addresses the practical challenge of balancing adhesive strength with peelability in pressure-sensitive adhesive products.

Collaborations

Mizuho Chiba is identified as Kitagawa’s coworker. The available information does not specify their particular projects or contributions.

Conclusion

Taiki Kitagawa’s patent describes an adhesive technology intended to combine reliable attachment with convenient removal, reflecting his contribution to re-peelable pressure-sensitive adhesive products.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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