Hong Kong, China

Tai Man Yue

USPTO Granted Patents = 5 

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2003-2020

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5 patents (USPTO):Explore Patents

Title: Innovations by Tai Man Yue: Pioneering Advances in Material Joining Techniques

Introduction

Tai Man Yue is a distinguished inventor based in Hong Kong, CN. He has made significant contributions to the field of material joining techniques, holding a total of 5 patents. His innovative approaches have the potential to revolutionize how dissimilar materials are bonded, enhancing the strength and reliability of various applications.

Latest Patents

One of Tai Man Yue's latest patents is a method of laser joining of dissimilar materials with ultrasonic aid. This new ultrasonic aided laser joining method (UAL) effectively eliminates laser-induced bubbles at the bonding faces, resulting in improved joint strength compared to the conventional laser-assisted metal and plastic joining method (LAMP). Experiments conducted on joining titanium to polyethylene terephthalate demonstrated the superiority of UAL over LAMP. The results indicated that the joint strength, measured in terms of failure load, significantly increased when ultrasonic vibration was employed during the laser joining process. In contrast to LAMP joined specimens, which typically fractured at the metal-plastic interface, UAL joined specimens exhibited fractures occurring in the parent plastic part. This improvement in joint strength is primarily attributed to the elimination of pores in the resolidified plastic. Additionally, ultrasonic vibration promotes chemical bonding between the plastic and metal parts, as supported by XPS results.

Another notable patent is the magnetic-aided electrospark deposition (M-ESD) method. This innovative approach utilizes a magnetized electrode to attract fine coating powders, allowing for a soft contact between the magnetized anode and the workpiece. The M-ESD method is particularly useful in various surface engineering applications, including the restoration and repair of damaged aircraft turbine blades, military engineering, and medical industries. Compared to conventional electrospark deposition, M-ESD can effectively address complicated surface geometries and internal surfaces while significantly reducing costs through the use of inexpensive components and simplified method steps.

Career Highlights

Tai Man Yue has had a notable career, contributing to prestigious institutions such as The Hong Kong Polytechnic University and The Chinese University of Hong Kong. His work has focused on advancing material joining techniques, making him a prominent figure in the field of engineering.

Collaborations

Throughout his career, Tai Man Yue has collaborated with esteemed colleagues, including Chak Yin Tang and Da-zhu Chen. These collaborations have further enriched his research and innovations, leading

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