The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Apr. 20, 2016
Applicant:

The Hong Kong Polytechnic University, Hong Kong, HK;

Inventors:

Jiang Wen Liu, Guangzhou, CN;

Tai Man Yue, Hong Kong, HK;

Zhichao Liu, Hong Kong, HK;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 9/26 (2006.01); B23K 9/04 (2006.01); C23C 26/02 (2006.01); B23K 9/32 (2006.01); B23K 103/04 (2006.01); B23K 103/14 (2006.01);
U.S. Cl.
CPC ...
B23K 9/26 (2013.01); B23K 9/042 (2013.01); B23K 9/32 (2013.01); C23C 26/02 (2013.01); B23K 2103/05 (2018.08); B23K 2103/14 (2018.08);
Abstract

A new electrospark deposition (ESD) method and related system are provided in the present invention based on the use of a magnetized electrode, namely magnetic-aided ESD (M-ESD). In particular, the present invention uses a magnetized electrode (either magnetized by an electro-magnet or being a permanent magnet) to attract fine coating powders at the tip thereof which acts as a soft brush to coat on intricate surface profiles. Accordingly, the method of the present invention is able to provide a soft contact between the magnetized anode and the workpiece to be coated or manipulated. The present invention is useful in various surface engineering applications in the fields of aeronautical (e.g. restoration and repair of damaged aircraft turbine blades), nuclear reactors, military engineering, and in medical industries. As compared to conventional ESD, the present invention can address complicated surface geometries and internal surfaces while the cost can be significantly lowered by using inexpensive components and simplified method steps.


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