Company Filing History:
Years Active: 2004-2006
Title: Innovations of Tai-heui Cho in Semiconductor Technology
Introduction
Tai-heui Cho is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the reliability and efficiency of semiconductor devices, particularly in high-speed integrated circuits.
Latest Patents
One of Cho's latest patents is titled "Semiconductor device having multilevel interconnections and method of manufacturing the same." This invention addresses the issue of electromigration in multilevel interconnections of high-speed integrated circuits. The design features a contact stud with a first portion that penetrates an intermetal insulating film and a second portion that protrudes above it. The vertical sidewalls and upper surface of the contact stud are entirely covered with a second metal interconnection layer, enhancing the device's performance.
Another notable patent is the "Bonding pad structure of a semiconductor device." This invention includes a bonding pad structure in an integrated circuit (IC) that comprises a plurality of dummy patterns connected via a metal link to top surface bonding pads. This innovative design improves contact reliability for both conductive and non-conductive pads, ensuring durability under pulling stresses.
Career Highlights
Tai-heui Cho is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced manufacturing techniques that enhance the performance and reliability of integrated circuits.
Collaborations
Cho has collaborated with notable colleagues, including Hyuck-Jin Kang and Min-Chul Kim. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.
Conclusion
Tai-heui Cho's contributions to semiconductor technology exemplify the importance of innovation in enhancing device performance and reliability. His patents reflect a commitment to advancing the field and addressing critical challenges in integrated circuit design.