The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Feb. 05, 2003
Tai-heui Cho, Suwon, KR;
Hyuck-jin Kang, Seoul, KR;
Min-chul Kim, Suwon, KR;
Byung-yoon Kim, Seoul, KR;
Tai-Heui Cho, Suwon, KR;
Hyuck-Jin Kang, Seoul, KR;
Min-Chul Kim, Suwon, KR;
Byung-Yoon Kim, Seoul, KR;
Samsung Electronics Co., Ltd., Kyungki-do, KR;
Abstract
A bonding pad structure in an integrated circuit (IC) and a method for manufacturing thereof comprises a plurality of dummy patterns deposited in sub-layers of the IC, each dummy pattern being connected via a metal link to a plurality of complementary top surface bonding pads, wherein the dummy patterns and the metal link are constructed during the same process steps used to construct the circuit elements included in the IC, without additional or special process steps. Such an imbedded and anchored bonding pad provides contact reliability for both conductive and non-conductive pads used for the interconnection of integrated circuits in a manner that resists layer separation or de-lamination under pulling stresses that are present on the bonding pads.