Tae Won Hwang

Title: Tae Won Hwang: Inventor of a Photocurable Adhesive for Three-Dimensional Electrical Components.

Introduction

Tae Won Hwang is an inventor associated with Cheonan-si, South Korea. His patent work includes a photocurable pressure-sensitive adhesive composition designed for electrical components with three-dimensional structures.

Latest Patents

Hwang is associated with 1 patent: “Photocurable Pressure-Sensitive Adhesive Composition for Electrical Components with Three-Dimensional Structure.” The invention describes a functional adhesive composition intended to provide heat resistance and bending resistance. Its specified ingredients include a urethane acrylate oligomer, an acrylate monomer, a photoinitiator, a silane coupling agent, a light stabilizer, an ultraviolet absorber, and an antioxidant. The patent also concerns an electrical component with a three-dimensional structure that uses the composition.

Career Highlights

Hwang’s listed company affiliations include Hyundai Mobis Corporation and Sonid Inc. His patent reflects work on adhesive materials for electrical components, with an emphasis on performance under heat and bending.

Collaborations

Hyeon Don Kim is identified as Hwang’s coworker. The available information does not specify their particular collaborative projects or contributions to the patent.

Conclusion

Tae Won Hwang’s patent focuses on a photocurable adhesive designed to support heat-resistant, bend-resistant electrical components with three-dimensional structures.