Tae Sung Jeong

Title: Tae Sung Jeong: Innovator in Integrated Circuit Packaging

Introduction

Tae Sung Jeong is a notable inventor based in Ich'on, South Korea. He has made significant contributions to the field of integrated circuit packaging, particularly with his innovative designs that enhance performance and efficiency. His work is recognized for its impact on the electronics industry.

Latest Patents

Tae Sung Jeong holds a patent for a Ball Grid Array Package. This invention discloses a packaged integrated circuit device that boasts high heat dissipation performance while maintaining a low weight. The device features an interconnection substrate with conductive trace material and insulating material layers. It includes a first surface and a second surface, with multiple electrical contacts on the second surface. A metal thermal conductive layer is attached to the first surface, and a through hole region is formed in both the interconnection substrate and the thermal conductive layer. An integrated circuit chip is placed within this region, ensuring efficient electrical connections through bond wires, all encapsulated in insulating material.

Career Highlights

Tae Sung Jeong is currently employed at Hyundai Electronics Industries Co. Ltd., where he continues to innovate in the field of electronics. His work has contributed to advancements in integrated circuit technology, making devices more efficient and reliable.

Collaborations

He has collaborated with notable coworkers, including Keun Hyoung Choi and Ki Tae Ryu, who share his commitment to innovation in electronics.

Conclusion

Tae Sung Jeong's contributions to integrated circuit packaging exemplify the importance of innovation in technology. His patent for the Ball Grid Array Package highlights his expertise and dedication to improving electronic devices.