Tae-Ho Lee

Title: **Innovative Contributions of Inventor Tae-Ho Lee**

Introduction

Tae-Ho Lee is an accomplished inventor hailing from Anyang-si, South Korea. With a focus on advancements in electroless gold plating technology, Lee has made significant contributions to the field, holding three patents to his name. His work combines chemistry and engineering to address challenges in the electronics industry, particularly regarding printed circuit boards.

Latest Patents

One of Tae-Ho Lee's most notable inventions is a substitution-type electroless gold plating solution. This innovative solution contains purine or pyrimidine-based compounds with carbonyl oxygen, which serves as a localized corrosion inhibitor. The formulation aims to provide uniform gold plating directly onto the copper wiring of printed circuit boards. The solution includes a mixture of components such as a water-soluble gold compound, an aminocarboxylic acid as a complexing agent, and other additives that enhance conductivity and stability, ensuring high reliability in solder mounting.

In addition, Lee developed an electroless gold plating liquid that enables gold plating without causing corrosion to the base metal. This invention allows for simultaneous substitution and reduction reactions, catering to both lead-free soldering weldability and wire bonding characteristics. The exceptional stability of this liquid maintains a consistent gold deposition rate throughout the plating process.

Career Highlights

Throughout his career, Tae-Ho Lee has worked with various companies, notably including Biosaint Co., Ltd. His expertise in the field has driven him to innovate solutions that address real-world industry challenges. Lee's patents reflect his commitment to advancing technology in electroless gold plating.

Collaborations

Tae-Ho Lee has collaborated with fellow professionals, including Deok-Gon Han and Hee Wook Ryu. These partnerships illustrate the collaborative spirit present in the scientific and engineering communities, often leading to groundbreaking advancements.

Conclusion

Tae-Ho Lee's contributions to the field of electroless gold plating represent an important progression in technology that benefits the electronics industry. His innovative solutions not only improve the quality of printed circuit boards but also enhance their durability and performance. As he continues to innovate, the significance of Lee's work is evident in the practical applications derived from his patents.