The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Dec. 22, 2014
Applicant:

MK Chem & Tech, Ansan-Si, Gyeonggi-Do, KR;

Inventors:

Tae-Ho Lee, Anyang-Si, KR;

Deok-Gon Han, Siheung-Si, KR;

Tae-Hyun Sung, Siheung-Si, KR;

Assignee:

MK CHEM & TECH, Anyang-Si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/44 (2006.01);
U.S. Cl.
CPC ...
C23C 18/44 (2013.01);
Abstract

The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained.


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