Tokyo, Japan

Tadayuki Wakatabi

USPTO Granted Patents = 12 

 

Average Co-Inventor Count = 1.8

ph-index = 5

Forward Citations = 67(Granted Patents)


Location History:

  • Amimachi, JP (2006)
  • Inashiki-gun, JP (2008)
  • Ibaraki, JP (2015)
  • Ibaraki-ken, JP (2013 - 2016)
  • Tokyo, JP (2005 - 2017)

Company Filing History:


Years Active: 2005-2017

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12 patents (USPTO):Explore Patents

Title: Tadayuki Wakatabi: Innovator in Sealed Letter Technology

Introduction

Tadayuki Wakatabi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of envelope technology, holding a total of 12 patents. His innovative designs focus on improving the efficiency and functionality of sealed letter production.

Latest Patents

One of Wakatabi's latest patents is a sealed letter producing device that incorporates an envelope sheet with pressure-sensitive adhesives. This device allows for the folding and sealing of an envelope with a content using smaller pressure rollers than those used in conventional methods. The design includes pressure-sensitive adhesives on both edge portions of the envelope sheet, along with remoistening paste that activates when the envelope is formed. This innovative approach reduces the need for high pressure across the entire envelope, streamlining the sealing process.

Career Highlights

Wakatabi has dedicated his career to advancing envelope technology, particularly through his work at Riso Kagaku Corporation. His inventions have not only improved production efficiency but have also enhanced the overall user experience in handling sealed letters.

Collaborations

Throughout his career, Wakatabi has collaborated with notable coworkers, including Kouki Mitani and Akiko Nozawa. Their combined efforts have contributed to the development of cutting-edge technologies in the field.

Conclusion

Tadayuki Wakatabi's innovative work in sealed letter technology exemplifies the impact of creativity and engineering in everyday products. His contributions continue to shape the future of envelope production and sealing methods.

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