Ichihara, Japan

Tadahiro Yokozawa

This inventor holds 3 USPTO granted patents and 5 published patent applications. Top assignee: Ube Industries, Inc.. Active years: 1995-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tadahiro Yokozawa. Retrieved from https://idiyas.com/inventor/tadahiro-yokozawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 66.7

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Chiba, JP (2011)
  • Ichihara, JP (1995 - 2018)

Company Filing History:


Years Active: 1995-2018

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3 patents (USPTO):Explore Patents

Title: Tadahiro Yokozawa: Innovator in Polyimide Film Technology

Introduction

Tadahiro Yokozawa is an inventor based in Ichihara-shi, Japan. He is known for his contributions to the field of polyimide film technology. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

Yokozawa's recent patent applications include a polyimide film designed for the production of a wiring board with a metal wiring. This film is created by forming a metal layer on one side of the polyimide film and etching it. The film is then curled toward the opposite side, with controlled curling to minimize drooping in the wiring board. This innovation aims to enhance handling characteristics and productivity in IC chip mounting. Another application involves a polyimide film that boasts improved adhesiveness to adhesives and adherence to metal layers. This film consists of at least two polyimide layers, with one layer formed from a tetracarboxylic dianhydride component and a specific diamine compound.

Conclusion

Tadahiro Yokozawa's work in polyimide film technology showcases his innovative spirit and potential impact on the industry. His latest patent applications reflect a commitment to improving materials used in electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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