Tact Lee

Title: Tact Lee: Innovator in Wire Bonding Technology

Introduction

Tact Lee is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of wire bonding technology, particularly through his innovative patent that addresses the detection of foreign particles during the bonding process. His work is essential for improving the efficiency and reliability of wire bonding operations.

Latest Patents

Tact Lee holds a patent for a method of bonding wires onto surfaces, which includes an apparatus and a computer program product. The patent, titled "Detection of foreign particles during wire bonding," outlines a method that involves collecting operating characteristics of a bonding tool while forming a wire bond. It determines whether a possible bonding failure has occurred based on these characteristics. If a potential failure is detected, the method captures an image of the wire bond to check for foreign bodies on the surface. This approach minimizes unnecessary imaging while ensuring that suspect bonds are thoroughly examined. This innovation significantly enhances the throughput of wire bonding apparatuses while effectively identifying and classifying bonding defects caused by foreign particles.

Career Highlights

Tact Lee is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop and refine technologies related to wire bonding. His expertise and innovative mindset have positioned him as a valuable asset in the field.

Collaborations

Tact Lee collaborates with talented colleagues, including Chin Kei Lai and Chung Yan Lau. Their combined efforts contribute to advancing the technology and ensuring high standards in their projects.

Conclusion

Tact Lee's contributions to wire bonding technology through his innovative patent demonstrate his commitment to enhancing manufacturing processes. His work not only improves efficiency but also ensures the quality and reliability of wire bonding operations.