Taoyuan, Taiwan

Ta-Chih Chung


Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 35(Granted Patents)


Location History:

  • Luzhu Township, Taoyuan County, TW (2014 - 2015)
  • Taoyuan Hsien, TW (2016)
  • Taoyuan, TW (2018 - 2019)

Company Filing History:


Years Active: 2014-2019

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7 patents (USPTO):Explore Patents

Title: Ta-Chih Chung: Innovator in Heat Dissipation and Conveying Technologies

Introduction

Ta-Chih Chung is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the fields of heat dissipation and conveying technologies. With a total of seven patents to his name, Chung has demonstrated a commitment to innovation and problem-solving in engineering.

Latest Patents

Chung's latest patents include a heat dissipation device and a conveying apparatus with a lift mechanism. The heat dissipation device features a mounting seat, a fan, and a frame designed to prevent back flowing hot airflow from being sucked into the air inlet. This innovative design enhances the efficiency of heat dissipation systems. The conveying apparatus incorporates a lift mechanism that allows for easy maintenance of storage devices. It includes a carrier, a holder, and a lift handle that simplifies the lifting process, making it quicker and more efficient.

Career Highlights

Chung is currently employed at Aic Inc., where he continues to develop and refine his inventions. His work has garnered attention for its practical applications and innovative designs. His contributions have not only advanced technology but have also improved user experience in various applications.

Collaborations

Chung has collaborated with notable colleagues, including Chung-I Kuo and Fu-An Jhang. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Ta-Chih Chung is a distinguished inventor whose work in heat dissipation and conveying technologies has made a significant impact. His innovative patents and collaborative efforts continue to drive advancements in engineering.

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