Clemmons, NC, United States of America

T Scott Morris

This inventor holds 2 USPTO granted patents. Top assignee: Rf Micro Devices, Inc.. Active years: 2010-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: T Scott Morris. Retrieved from https://idiyas.com/inventor/t-scott-morris

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 2010-2011

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of T. Scott Morris in Electromagnetic Shielding

Introduction: T. Scott Morris is an esteemed inventor located in Clemmons, North Carolina. With a total of two patents to his name, Morris has made significant strides in the field of electromagnetic interference shielding and flip-chip assembly technology. His work demonstrates a commitment to enhancing electronic manufacturing processes.

Latest Patents: Morris's most recent patents highlight his innovative approach towards the development of electronic components. The first patent, titled "Sub-module Conformal Electromagnetic Interference Shield," describes a manufacturing process that involves creating a meta-module consisting of circuitry for multiple sub-modules. This process includes the application of an electromagnetic shield to the exterior surface of the overmold body for each sub-module. This invention enhances the efficiency of shielding electronic components, addressing critical needs in the industry.

The second patent, "Flip-Chip Assembly with Improved Interconnect," introduces a unique method for connecting a flip-chip die to a substrate. This method involves the formation of metallic posts on the flip-chip die, with solder bumps strategically placed on the substrate. By utilizing a tip layer of materials such as flash gold or tin, Morris’s invention minimizes oxidation and enhances wettability, leading to improved connections in electronic devices when the flip-chip die is heated and bonded to the substrate.

Career Highlights: T. Scott Morris has applied his expertise at Rf Micro Devices, Inc., where his contributions have been integral in developing advanced semiconductor technologies. His inventiveness and commitment to technological progression are evident in the patents he has secured and the projects he undertakes within the company.

Collaborations: Throughout his career, Morris has collaborated with remarkable colleagues, including Milind Shah and Donald Joseph Leahy. Their combined efforts underscore the importance of teamwork in driving innovation and achieving breakthroughs in technology.

Conclusion: T. Scott Morris exemplifies the impact of innovations in the field of electronics through his patents on electromagnetic shielding and flip-chip assembly. His work not only advances manufacturing processes but also demonstrates the importance of inventive thinking in technological development. As he continues his career at Rf Micro Devices, Inc., the contributions of Morris signal an ongoing commitment to enhancing electronic component reliability and functionality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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