Cambridge, MA, United States of America

Syed M Alam


Average Co-Inventor Count = 8.0

ph-index = 2

Forward Citations = 575(Granted Patents)


Company Filing History:


Years Active: 2007-2010

where 'Filed Patents' based on already Granted Patents

2 patents (USPTO):

Title: Syed M Alam: Innovator in Three Dimensional Integrated Circuits

Introduction

Syed M Alam is a prominent inventor based in Cambridge, MA (US). He has made significant contributions to the field of integrated circuits, particularly in the development of three-dimensional (3D) integrated circuits. With a total of 2 patents, his work has paved the way for advancements in circuit design and fabrication.

Latest Patents

Syed M Alam's latest patents include innovative designs for three-dimensional integrated circuits. One of his notable patents is titled "Three Dimensional Integrated Circuit and Method of Design." This invention describes a 3D integrated circuit (IC) chip that incorporates multiple layers of circuits, such as silicon insulator (SOI) CMOS IC layers, each containing circuit elements. The design allows for the layers to be formed in parallel, with one layer attached to another, resulting in a laminated 3D chip. This technology enhances the performance and efficiency of integrated circuits.

Career Highlights

Syed M Alam is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of integrated circuits. His work at IBM has allowed him to collaborate with leading experts and contribute to cutting-edge technology.

Collaborations

Some of Syed M Alam's notable coworkers include Ibrahim M Elfadel and Kathryn Wilder Guarini. Their collaboration has fostered an environment of innovation and creativity, further enhancing the development of advanced integrated circuit technologies.

Conclusion

Syed M Alam's contributions to the field of three-dimensional integrated circuits demonstrate his commitment to innovation and excellence. His patents and work at IBM highlight the importance of collaboration in driving technological advancements.

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