Location History:
- Butterworth, MY (2005 - 2006)
- Bullerworth, MY (2007)
Company Filing History:
Years Active: 2005-2007
Title: Innovations of Swee Cheng Ho
Introduction
Swee Cheng Ho is a notable inventor based in Butterworth, Malaysia. He has made significant contributions to the field of electronics, particularly in the testing of solder joint connections in printed circuit boards (PCBs). With a total of three patents to his name, his work has garnered attention in the industry.
Latest Patents
One of Swee Cheng Ho's latest patents is focused on socket connection test modules and methods of using the same. This invention presents test modules, systems, and methods that employ capacitors for testing solder joint connections between a PCB and a device socket. The test module features capacitors in parallel, specifically embedded capacitors, which can be utilized to test tied traces and their solder joint connections by measuring the total capacitance. The invention also includes no-power tests that can be applied across various testing platforms and fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA). Additionally, the test module is compatible with various socket types, including ball grid arrays, pinned grid arrays, and land grid arrays.
Career Highlights
Swee Cheng Ho is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has allowed him to be at the forefront of advancements in electronic testing methodologies.
Collaborations
Some of his notable coworkers include Teik Sean Toh and Tzyy Haw Tan, who contribute to the collaborative environment at Intel Corporation.
Conclusion
Swee Cheng Ho's contributions to the field of electronics through his innovative patents and work at Intel Corporation highlight his importance as an inventor. His advancements in testing methodologies are paving the way for improved electronic device reliability.