Location History:
- Schönefeld, DE (2015)
- Berlin, DE (2020)
Company Filing History:
Years Active: 2015-2020
Title: **Innovations by Sven Rückbrod: A Patent Legacy in Electrodeposition**
Introduction
Sven Rückbrod, an accomplished inventor based in Berlin, Germany, has made significant contributions to the field of electrochemical processes and material deposition. With a total of two patents to his name, Rückbrod's work is instrumental in advancing technologies used in electronic applications, particularly in the manufacture of printed circuit boards and related devices.
Latest Patents
Rückbrod's latest patents reflect his innovative approach to aqueous plating bath compositions. His first patent, titled "Electrolytic Copper Plating Bath Compositions and a Method for Their Use," addresses the need for efficient copper deposition in various electronic applications. This invention features a unique formulation that includes a source of copper ions, an acid, and a guanidine compound, making it particularly effective for plating recessed structures with copper and building copper pillar bump structures.
The second patent, "Plating Bath for Electroless Deposition of Nickel Layers," showcases his expertise in nickel layer deposition utilizing novel stabilizing agents. These agents possess a carbon-carbon triple bond along with functional groups designed to enhance the performance of the plating bath. This invention further solidifies Rückbrod's position as a pioneer in the development of advanced conductive materials.
Career Highlights
Sven Rückbrod is currently associated with Atotech Deutschland GmbH, a leading company in specialty chemicals and equipment for electronics and surface finishing. His tenure at Atotech has allowed him to translate theoretical concepts into practical solutions that are now used in various high-tech applications. Rückbrod's dedication to innovation has not only benefited his company but also the broader electronics industry.
Collaborations
During his career, Rückbrod has collaborated with esteemed coworkers, including Heiko Brunner and Jan Picalek. These partnerships have facilitated the exchange of ideas and expertise, contributing to the successful development and enhancement of the technologies pertaining to electrochemical plating processes.
Conclusion
Sven Rückbrod's contributions to the field of electrochemical deposition are impressive and essential for advancing electronic manufacturing technologies. With his two patented innovations, he has showcased his ability to solve complex challenges in material deposition. As he continues his work at Atotech, Rückbrod undoubtedly remains an influential figure in the landscape of innovation within the electronics sector.