The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Apr. 20, 2016
Applicant:

Atotech Deutschland Gmbh, Berlin, DE;

Inventors:

Heiko Brunner, Berlin, DE;

Dirk Rohde, Berlin, DE;

Manuel Pölleth, Berlin, DE;

Sven Rückbrod, Berlin, DE;

Desthree Darwin, Berlin, DE;

Sandra Niemann, Berlin, DE;

Gerhard Steinberger, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/58 (2006.01); C25D 3/38 (2006.01); C23C 18/38 (2006.01); C25D 7/00 (2006.01); C25D 21/00 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 7/00 (2013.01); C25D 21/00 (2013.01);
Abstract

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.


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