Sutee Vongfuangfoo is a notable inventor based in Sunnyvale, CA (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 9 patents. His work has advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

Among his latest patents is the "Integrated circuit packaging apparatus and method." This invention provides an apparatus and method for assembling solder balls in various patterns for delivery to connector pads on an integrated circuit package. It features a universal template that allows for easy alignment with an assembly jig while enabling the use of subtemplates to change the surface pattern of holes for solder ball distribution. Another significant patent is the "PBGA stiffener package," which includes a PBGA member, a stiffener ring, and a stiffener fixture. This design ensures that the stiffener ring and PBGA member are coplanar to less than 8 mils, enhancing the overall integrity of the package.

Career Highlights

Sutee has worked with LSI Logic Corporation, where he honed his skills in integrated circuit technology. His experience in this company has been instrumental in shaping his innovative approaches to circuit packaging.

Collaborations

Throughout his career, Sutee has collaborated with talented individuals such as Mirek Boruta and Galen Kirkpatrick. These partnerships have contributed to the development of his groundbreaking inventions.

Conclusion

Sutee Vongfuangfoo's contributions to integrated circuit packaging have made a lasting impact on the industry. His innovative patents and collaborations reflect his dedication to advancing technology in electronics.

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