The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 1994

Filed:

Jan. 16, 1992
Applicant:
Inventors:

Sutee Vongfuangfoo, Sunnyvale, CA (US);

Matthew Preston, San Jose, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257727 ; 257678 ;
Abstract

Damage to the package body and external leads of a leaded semiconductor device assembly is prevented by a carrier assembly. The carrier assembly includes a rigid bottom (lower) plate positively supporting the package body and providing a bottom cover for the external leads. A semi-rigid top (upper) plate positively holds the package body against the bottom plate, prevents movement of the package body with respect to the carrier assembly, and covers the external leads. Fasteners are provided for securing the upper plate to the lower plate, preferably at the four corners of the plates. In this manner, a durable 'sandwich' structure is created, with the package disposed between the lower and upper plates and the body and leads well protected against damage.


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