Susumu Okatani

Title: Susumu Okatani: Innovator in Aqueous Emulsion Compositions

Introduction

Susumu Okatani is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of adhesive technologies, particularly through his innovative aqueous emulsion compositions. His work has led to advancements that enhance adhesion strength for a variety of materials.

Latest Patents

Okatani holds 2 patents related to aqueous emulsion compositions and adherent compositions. His latest patents focus on providing an aqueous emulsion composition that exhibits high adhesion strength for a wide range of materials, including molded products. This composition ensures sufficient wettability for objects with low surface polarity, allowing for effective adhesive bonding. The emulsion is designed to be stable, offering good mechanical and storage stability. Additionally, his adherent composition includes a mixture of ethylene-vinyl acetate copolymer or modified resin, photo polymerization initiator, and unsaturated ethylenic monomer, which are emulsified in water using a surface-active agent. This innovative approach results in a composition that can be used for bonding various molded products, such as plastic films, sheets, foams, fibers, synthetic leathers, and metals, while minimizing fire risks and promoting environmental sanitation.

Career Highlights

Okatani is currently associated with Mitsui Takeda Chemicals, Inc., where he continues to develop and refine his innovative adhesive technologies. His work has positioned him as a key figure in the field of adhesive bonding solutions.

Collaborations

Throughout his career, Okatani has collaborated with notable colleagues, including Hirofumi Morita and Kenji Kuroda. These collaborations have further enriched his research and development efforts in adhesive technologies.

Conclusion

Susumu Okatani's contributions to aqueous emulsion compositions have significantly impacted the adhesive industry. His innovative approaches continue to enhance the performance and safety of adhesive bonding solutions.