Pune, India

Sushil Khandelwal

This inventor holds 1 USPTO granted patent. Top assignee: Deere & Company. Active years: 2017.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Sushil Khandelwal: Innovator in Electronic Assembly Technology

Introduction

Sushil Khandelwal is a notable inventor based in Pune, India. He has made significant contributions to the field of electronic assembly technology. His innovative approach has led to the development of a unique patent that enhances thermal dissipation in electronic devices.

Latest Patents

Sushil Khandelwal holds a patent for an "Electronic assembly with frame for thermal dissipation." This invention comprises a first circuit board with a first substrate that has an inner side and an outer side. A plurality of primary components are mounted on the inner side of the first circuit board. A frame, which acts as a heat-sinking spacer, is secured to the first circuit board. Additionally, a second circuit board is secured to the frame and separated from the first circuit board in at least one spatial dimension. At least one secondary component is mounted on the second circuit board. The design includes a first housing section that is adapted for mating with a second housing section, collectively enclosing both circuit boards.

Career Highlights

Sushil Khandelwal is currently employed at Deere & Company, where he continues to innovate and contribute to advancements in electronic assembly technology. His work is characterized by a commitment to improving the efficiency and effectiveness of electronic devices.

Collaborations

Throughout his career, Sushil has collaborated with talented individuals such as Pablo G Olivieri and Stephen Piltingsrud. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Sushil Khandelwal's contributions to electronic assembly technology exemplify the spirit of innovation. His patent for an electronic assembly with enhanced thermal dissipation showcases his expertise and commitment to advancing technology in this field.

Profile summary based on public USPTO records.
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