Sterling Heights, MI, United States of America

Susan Sevidal-Marte




Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Susan Sevidal-Marte: Innovator in Glass Bonding Technology

Introduction

Susan Sevidal-Marte is a notable inventor based in Sterling Heights, MI (US). She has made significant contributions to the field of adhesive technology, particularly in glass bonding. Her innovative work has led to the development of a unique primer composition that enhances the bonding process for glass materials.

Latest Patents

Susan holds 1 patent for her invention titled "Primer composition for glass bonding." This invention describes a one-component bonding agent that includes a specific formulation comprising from about 3 to 60% by weight of a first polymer. The first polymer is the reaction product of a first oligomer, which consists of an epoxy functional silane and an amine functional monomer, along with a second oligomer that includes a monomeric isocyanate and a functionalized tri-alkoxysilane. This innovative primer composition is designed to improve the efficiency and effectiveness of glass bonding applications.

Career Highlights

Susan is currently employed at Dow Global Technologies LLC, where she continues to advance her research and development efforts in adhesive technologies. Her work at Dow has allowed her to collaborate with other experts in the field and contribute to the company's innovative projects.

Collaborations

One of her notable coworkers is Syed Zafar Mahdi, with whom she has likely collaborated on various projects related to adhesive technologies. Their combined expertise contributes to the advancement of innovative solutions in the industry.

Conclusion

Susan Sevidal-Marte's contributions to glass bonding technology exemplify her dedication to innovation and excellence in her field. Her patent for a primer composition showcases her ability to create effective solutions that enhance bonding processes.

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