Susan Acheson Mack

Title: **Susan Acheson Mack: Innovator in Flip Chip Technology**

Introduction

Susan Acheson Mack is a notable inventor based in Kokomo, Indiana. She has made significant contributions to the field of electronics through her inventive spirit and dedication to improving circuit board technology. With two patents to her name, Susan is recognized for her advancements in flip chip circuit board assembly, which have proven to be vital in enhancing the reliability of electronic devices under extreme thermal conditions.

Latest Patents

Susan's latest patents focus on a groundbreaking process for producing flip chip circuit board assemblies. The first patent describes a novel process and combination of materials for underfilling a surface-mount integrated circuit device, such as a flip chip. This innovation aims to increase the thermal cycle fatigue life of the terminals that attach the device to thin-laminate organic circuit boards, such as printed wiring boards or printed circuit boards. The parameters and materials employed demonstrate a synergistic effect that significantly elevates thermal cycle fatigue resistance, enabling devices to endure at least 1000 one-hour cycles between -40°C and 150°C.

Additionally, her second patent introduces solderable contacts for flip chip integrated circuit devices. This innovation features a design where solder bumps are strategically spaced apart from the perimeter of the device. Electrically conductive runners connect these solder bumps to accessible points at the perimeter, allowing for optimized placement without compromising the device's size.

Career Highlights

Throughout her career, Susan has been associated with Delco Electronics Corporation, where she has played a crucial role in advancing electronic technologies. Her innovative mindset and technical expertise in circuit assembly have made her a valuable asset to her company and the industry as a whole.

Collaborations

Susan Acheson Mack has collaborated with esteemed colleagues, including William David Higdon and Ralph Edward Cornell. Together, they have contributed to the development of cutting-edge technologies that enhance the durability and functionality of electronic components, showcasing the importance of teamwork in driving innovation.

Conclusion

Susan Acheson Mack exemplifies the spirit of innovation and the importance of continuous advancement in the electronics field. Her patents have not only contributed to the performance of flip chip devices but have also set a foundation for future inventions. As technology continues to evolve, the contributions of inventors like Susan will undoubtedly lead the way to more resilient and efficient electronic systems.