This inventor holds 1 USPTO granted patent. Top assignee: Skyworks Solutions, Inc.. Active years: 2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2007
Title: Innovations by Suresh Jayaraman: A Pathway to Enhanced Semiconductor Packaging
Introduction
Suresh Jayaraman, based in Ladera Ranch, California, is a noteworthy inventor in the field of semiconductor technology. With a patent under his name, Suresh brings innovation to the industry, particularly in the realm of packaging techniques that enhance the performance of electronic devices.
Latest Patents
Suresh holds a significant patent for an "Overmolded semiconductor package with an integrated EMI and RFI shield." This innovative design features a semiconductor die placed on a substrate, with an overmold that encapsulates both components. The patent highlights an exemplary embodiment where a conductive layer made from a conductive polymer is applied on the top surface of the overmolded package, effectively creating a shield against electromagnetic interference (EMI) and radio frequency interference (RFI). Further enhancements in the design include a post connected to the conductive layer and a hole filled with the conductive polymer, ensuring robust connectivity and protection.
Career Highlights
Suresh operates at Skyworks Solutions, Inc., a company recognized for its contributions to the semiconductor sector. His work focuses on advancing packaging solutions that not only protect sensitive electronic components but also improve their operational reliability.
Collaborations
During his time at Skyworks Solutions, Suresh has collaborated with talented individuals such as Robert W. Warren and Larry D. Pottebaum. These collaborations reflect a shared commitment to innovation and excellence in semiconductor technology.
Conclusion
Suresh Jayaraman stands out as an inventor who has made significant strides in the semiconductor industry through his patent innovations. His work on overmolded packaging solutions showcases the potential of technological advancements in enhancing electronic device performance. As his career continues to develop, Suresh's contributions will likely inspire further innovations within the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile