This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2019.
Company Filing History:
Years Active: 2019
Title: Innovations of Sungwoo Joo in Semiconductor Technology
Introduction
Sungwoo Joo is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the design of semiconductor packages. With a total of 2 patents to his name, Joo's work is recognized for its innovative approach to heat management in semiconductor devices.
Latest Patents
One of Joo's latest patents involves semiconductor packages that include a heat pipe for effectively exhausting heat from one or more ends of the package. This design features a package substrate with a fastening section at one end and a connecting terminal section at the opposite end. It incorporates at least one semiconductor device mounted on the substrate, along with a heat pipe positioned on the semiconductor device. A lid covers both the semiconductor device and the heat pipe, ensuring efficient thermal management. The heat pipe's design allows at least one end to be situated between the semiconductor device and either the fastening or connecting terminal section, enhancing the overall functionality of the package.
Career Highlights
Sungwoo Joo is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to focus on advancing semiconductor technologies, contributing to the company's reputation for innovation and quality.
Collaborations
Throughout his career, Joo has collaborated with talented individuals such as JaeHong Park and Hanhong Lee. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor field.
Conclusion
Sungwoo Joo's contributions to semiconductor technology, particularly through his innovative patents, highlight his role as a key inventor in the industry. His work continues to influence advancements in heat management solutions for semiconductor devices.
