Seoul, South Korea

Sungjin Yun


 

Average Co-Inventor Count = 4.7

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2015-2016

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5 patents (USPTO):Explore Patents

Title: Innovations by Inventor Sungjin Yun in Epoxy Resin Composition

Introduction: Sungjin Yun is a notable inventor based in Seoul, South Korea. He holds an impressive portfolio of five patents, showcasing his contributions to the field of materials science, particularly in epoxy resin formulations and printed circuit board technology.

Latest Patents: One of Sungjin Yun's latest inventions focuses on a unique resin composition tailored for printed circuit boards. This epoxy resin composition consists of an epoxy compound blended with triethylenediamine, diphenylphosphine, and/or tetraphenylborate. It also includes a curing agent that comprises diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine, and/or triethanolamine, along with an inorganic filler categorized by particle size involving at least two alumina groups. Furthermore, another patent from Yun addresses an epoxy resin composition featuring an inorganic filler of boron nitride, enhancing the properties of printed circuit boards.

Career Highlights: Sungjin Yun has established himself as a key figure in the advancements of epoxy resin technologies at LG Innotek Co., Ltd. His innovative work not only signifies his expertise but also reflects the company's commitment to technological progress in materials for electronic applications.

Collaborations: Throughout his career, Sungjin Yun has collaborated with esteemed colleagues such as Jae Man Park and Jeungook Park. These collaborations contribute to the dynamic environment at LG Innotek, fostering innovation and enhancing the quality of their projects.

Conclusion: Sungjin Yun's contributions to the field of materials science, particularly through his patents in epoxy resin compositions, demonstrate his significant role in advancing technology. His work not only augments the capabilities of printed circuit boards but also paves the way for future innovations in electronic materials.

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