The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Apr. 29, 2013
Lg Innotek Co., Ltd., Seoul, KR;
Jae Man Park, Seoul, KR;
Hae Yeon Kim, Seoul, KR;
SungBae Moon, Seoul, KR;
Jeungook Park, Seoul, KR;
SungJin Yun, Seoul, KR;
JongHeum Yoon, Seoul, KR;
Hyuk Soo Lee, Seoul, KR;
Jaehun Jeong, Seoul, KR;
In Hee Cho, Seoul, KR;
LG Innotek Co., Ltd., Seoul, KR;
Abstract
An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.