Hwaseong, South Korea

Sungil Lee

This inventor holds 3 USPTO granted patents. Top assignees: Samsung Electronics Co., Ltd., Hyundai Motor Company, Kia Motors Corporation. Active years: 2014-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sungil Lee. Retrieved from https://idiyas.com/inventor/sungil-lee-o3exmf99

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 66.7

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014-2024

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Sungil Lee

Introduction

Sungil Lee is a notable inventor based in Hwaseong, South Korea. He has made significant contributions to the field of manufacturing technology, particularly in the development of solder bump manufacturing techniques. With a total of 3 patents to his name, Lee's work has had a considerable impact on the electronics industry.

Latest Patents

One of Sungil Lee's latest patents is an apparatus and method for manufacturing solder bumps. This innovative apparatus includes a supporter designed to hold the substrate, a housing that surrounds the supporter, and a cover that defines a manufacturing space. The cover features an edge heating zone along its perimeter, which enhances the manufacturing process. Additionally, the apparatus is equipped with an oxide remover supply nozzle that delivers an oxide remover to the manufacturing space, ensuring optimal conditions for solder bump formation.

Career Highlights

Throughout his career, Sungil Lee has worked with prominent companies such as Samsung Electronics Co., Ltd. and Kia Motors Corporation. His experience in these leading organizations has allowed him to refine his skills and contribute to various technological advancements in the industry.

Collaborations

Sungil Lee has collaborated with talented individuals in his field, including Sanghoon Lee and Sungyong Yun. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Sungil Lee's contributions to the field of manufacturing technology, particularly in solder bump production, highlight his innovative spirit and dedication to advancing the industry. His patents and collaborations reflect a commitment to excellence and a drive to push the boundaries of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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