Sung-Yuan Lin

Title: Innovations of Sung-Yuan Lin

Introduction

Sung-Yuan Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative work has led to the development of a unique patent that enhances the functionality of ball grid array packages.

Latest Patents

Sung-Yuan Lin holds a patent for a "Ball grid array package and package substrate thereof." This invention involves a package substrate designed for a ball grid array package. The substrate features two substrate contacts, two solder ball pads, two via holes, and two signal lines. The connection line of the two substrate contacts is substantially perpendicular to the connection line of the two solder ball pads. Each signal line includes a circuit trace section, an approaching section, and a bifurcating section connected in sequence. The design ensures that the two circuit trace sections of each signal line are arranged in parallel, while the approaching sections are symmetrical about the connection line of the solder ball pads.

Career Highlights

Sung-Yuan Lin is currently employed at Realtek Semiconductor Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing packaging technologies that are crucial for modern electronic devices.

Collaborations

Some of his notable coworkers include Che-Ming Hsu and Nai-Jen Hsuan, who have collaborated with him on various projects within the company.

Conclusion

Sung-Yuan Lin's contributions to the field of semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work at Realtek Semiconductor Inc. continues to influence the industry positively.