Company Filing History:
Years Active: 2020
Title: Innovations of Sung Ii Kang in Semiconductor Technology
Introduction
Sung Ii Kang is a notable inventor based in Gimhae-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for manufacturing semiconductor package substrates.
Latest Patents
Sung Ii Kang holds 1 patent for his invention titled "Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same." This patent describes a method that includes forming a trench and a post by etching an upper surface of a base substrate made of a conductive material. The process involves filling the trench with resin, ensuring that the upper surfaces of the post and resin are level, and forming a conductive layer across these surfaces. Finally, it details the formation of circuit wiring through simultaneous patterning.
Career Highlights
Sung Ii Kang is associated with Haesung DS Co., Ltd., where he applies his expertise in semiconductor manufacturing. His work has been instrumental in advancing the technology used in semiconductor packaging.
Collaborations
He has collaborated with notable coworkers, including In Seob Bae and Jea Won Kim, contributing to various projects within the company.
Conclusion
Sung Ii Kang's innovative methods in semiconductor technology exemplify the advancements being made in this critical field. His contributions continue to influence the industry positively.