Sung Hoon Lee

Title: The Innovative Contributions of Sung Hoon Lee

Introduction

Sung Hoon Lee is a notable inventor based in Asan-si, South Korea. He has made significant contributions to the field of integrated circuit technology. His work focuses on enhancing the performance and reliability of integrated circuit package substrates.

Latest Patents

Sung Hoon Lee holds a patent for an integrated circuit package substrate. This invention relates to a substrate that exhibits excellent conductivity and reliability. It achieves this through the improvement of the adhesive force between a metal line and glass formed inside the substrate. The integrated circuit package substrate comprises a core part made of glass, a first metal thin plate made of copper (Cu) on the upper part, and a second metal thin plate made of Cu on the lower part. A metal line connects these two plates and is also made of Cu. An intermediate layer on the outer circumferential surface of the metal line includes materials such as CuO or CuO doped with a transition metal.

Career Highlights

Sung Hoon Lee is currently employed at Corning Precision Materials Co., Ltd. His work at this company has allowed him to focus on innovative solutions in the field of materials science. His patent reflects his commitment to advancing technology in integrated circuits.

Collaborations

Sung Hoon Lee has collaborated with talented coworkers, including Hyun Hang Park and Bo Gyeong Kim. Their teamwork has contributed to the development of cutting-edge technologies in their field.

Conclusion

Sung Hoon Lee's contributions to integrated circuit technology demonstrate his innovative spirit and dedication to improving electronic materials. His patent showcases the potential for advancements in the industry, highlighting the importance of research and collaboration in driving innovation.